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Praetorian III(R) 4, 6, 8-Channel EMI Filter Array with ESD Protection CM1457
Features
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Functional Description
The CM1457 is an inductor-based (L-C) EMI filter array with ESD protection, which integrates four, six, or eight filters in a CSP form factor with 0.40mm pitch. Each EMI filter channel of the CM1457 is implemented with the component value of 6pF-35nH-4.7pF-35nH-1.8pF. The cut-off frequency at -3dB attenuation is 300MHz and can be used in applications where the data rates are as high as 160Mbps, while providing greater than -35dB attenuation over the 800MHz to 2.7GHz frequency range. The parts include ESD diodes on every I/O pin and provide a high level of protection against electrostatic discharge (ESD). The ESD protection diodes connected to the external filter ports are designed and characterized to safely dissipate ESD strikes of 15kV, which is beyond the maximum requirement of the IEC61000-4-2 international standard.
Four, six, or eight channels of EMI filtering 15kV ESD protection (IEC 61000-4-2, contact discharge) at external pins Greater than -40dB of attenuation at 1GHz MIL_STD_883 international ESD standard Chip Scale Package (CSP) with 0.40mm pitch and 0.25mm CSP solder ball which features extremely low parasitic inductance for optimum filter and ESD performance
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OptiGuardTM coating for improved reliability at assembly RoHS-compliant, lead-free finishing
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Applications
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LCD and camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data ports in cell phones, PDAs or notebook computer Wireless handsets Handheld PCs/PDAs LCD and camera modules This device is particularly well suited for wireless handsets, mobile LCD modules and PDAs because of its small package format and easy-to-use pin assignments. In particular, the CM1457 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in mobile handsets. The CM1457 incorporates OptiGuardTM which results in improved reliability at assembly. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space savings vs. competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball.
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Note: Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. See http://www.wlcspforum.org/documents/pdf/ap217.pdf for download.
Block Diagram
35nH
35 nH
Cn* (Externa l Pi ns)
6p F
4 .7p F
1 .8 p F
An* (Interna l Pins)
GND (Pins B1 -B4)
(c)2010 SCILLC. All rights reserved. May 2010 - Rev. 4
Publication Order Number: CM1457/D
CM1457
Pin Configurations
Rev. 4 | Page 2 of 9 | www.onsemi.com
CM1457
Pin Descriptions
PIN NUMBER -04 A1 A2 A3 A4 -06 A1 A2 A3 A4 A5 A6 -08 A1 A2 A3 A4 A5 A6 A7 A8 B1 B2 B1 B2 B3 B1 B2 B3 B4 PIN DESCRIPTION Filter #1 (Internal) Filter #2 (Internal) Filter #3 (Internal) Filter #4 (Internal) Filter #5 (Internal) Filter #6 (Internal) Filter #7 (Internal) Filter #8 (Internal) GND GND GND GND PIN NUMBER -04 C1 C2 C3 C4 -06 C1 C2 C3 C4 C5 C6 -08 C1 C2 C3 C4 C5 C6 C7 C8 PIN DESCRIPTION Filter #1 (External) Filter #2 (External) Filter #3 (External) Filter #4 (External) Filter #5 (External) Filter #6 (External) Filter #7 (External) Filter #8 (External)
Ordering Information Bumps
10 15 20
Package
CSP CSP CSP
Ordering Part Number1
CM1457-04CP CM1457-06CP CM1457-08CP
Part Marking2
N57 (w) N57 (yww) N57 (yyww)
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Note 2: (w/yww/yyww) = date code
Absolute Maximum Ratings
PARAMETER Storage Temperature Range DC current per Inductor DC Package Power Rating RATING -65 to +150 15 0.5 UNITS C mA W
Rev. 4 | Page 3 of 9 | www.onsemi.com
CM1457
Standard Operating Conditions
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
Electrical Operating Characteristics (see Note 1)
SYMBOL LTOT RTOT CTOT_0V CTOT_2.5V PARAMETER Total Channel Inductance Total Channel DC Resistance Total Channel Capacitance, 0V bias Total Channel Capacitance, 2.5V bias 0V dc; 1MHz, 30mV rms 2.5V dc; 1MHz, 30mV rms CONDITIONS MIN TYP 70 45 20 12.5 24 MAX UNITS nH pF pF
VST ILEAK VSIG
Stand-off Voltage Diode Leakage Current Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Contact discharge per IEC 61000-4-2 standard, Level 4 (External Pins) b) Contact discharge per IEC 61000-4-2 standard, Level 4 (Internal Pins) Cut-off frequency ZSOURCE = 50, ZLOAD = 50
I = 10A VIN = +3.3V
5.5 0.1 0.5
V A
ILOAD = 10mA ILOAD = -10mA Notes 2 and 3
5.6 -1.5
6.8 -0.8
9.0 -0.4
V V
VESD
15 2
kV
kV
fC
300
MHz
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Unused pins are left open.
Rev. 4 | Page 4 of 9 | www.onsemi.com
CM1457
Performance Information
Insertion Loss Vs. Frequency (0V Bias)
0 dB
-10 dB
-20 dB
-30 dB
-40 dB
-50 dB
3 10 100 FREQUENCY (MHz) 1000 2000 6000
Insertion Loss Vs. Frequency (2.5V Bias)
Rev. 4 | Page 5 of 9 | www.onsemi.com
CM1457
CM1457-04CP Mechanical Specifications
The 10-bump CM1457-04CP package dimensions are shown below.
Package Specifications Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 10 Inches
1.627 1.672 1.717 0.0641 0.0658 0.0676 1.008 1.053 1.098 0.0397 0.0415 0.0432 0.395 0.400 0.405 0.0156 0.0157 0.0159 0.195 0.200 0.205 0.0077 0.0079 0.0081 0.342 0.347 0.352 0.0135 0.0137 0.0139 0.342 0.347 0.352 0.0135 0.0137 0.0139 0.186 0.236 0.286 0.0073 0.0093 0.0113 0.130 0.180 0.230 0.0051 0.0071 0.0090 0.545 0.615 0.685 0.0215 0.0242 0.0270 0.378 0.419 0.460 0.0149 0.0165 0.0181 Controlling dimension: millimeters Package Dimensions for CM1457-04CP Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER CM1457-04CP CHIP SIZE (mm) 1.67 X 1.05 X 0.615 POCKET SIZE (mm) B0 X A0 X K0 1.80 X 1.27 X 0.73 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm
Rev. 4 | Page 6 of 9 | www.onsemi.com
CM1457
CM1457-04CP Mechanical Specifications
The 15-bump CM1457-06CP package dimensions are shown below.
Package Specifications Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 15 Inches
2.427 2.472 2.517 0.0956 0.0973 0.0992 1.008 1.053 1.098 0.0397 0.0415 0.0432 0.395 0.400 0.405 0.0156 0.0157 0.0159 0.195 0.200 0.205 0.0077 0.0079 0.0081 0.342 0.347 0.352 0.0135 0.0137 0.0139 0.342 0.347 0.352 0.0135 0.0137 0.0139 0.187 0.237 0.287 0.0074 0.0093 0.0113 0.130 0.180 0.230 0.0051 0.0071 0.0090 0.545 0.615 0.685 0.0215 0.0242 0.0270 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1457-06CP Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications PART NUMBER CM1457-06 CHIP SIZE (mm) 2.47 X 1.05 X 0.615 POCKET SIZE (mm) B0 X A0 X K0 2.59 X 1.27 X 0.73 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm
Rev. 4 | Page 7 of 9 | www.onsemi.com
CM1457
CM1457-08CP Mechanical Specifications
The 20-bump CM1457-08CP package dimensions are shown below.
Package Specifications Package Bumps Dim Millimeters Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Custom CSP 20 Inches Nom Max
3.227 3.272 3.317 0.1270 0.1288 0.1306 1.008 1.053 1.098 0.0397 0.0415 0.0432 0.395 0.400 0.405 0.0156 0.0157 0.0159 0.195 0.200 0.205 0.0077 0.0079 0.0081 0.342 0.347 0.352 0.0135 0.0137 0.0139 0.342 0.347 0.352 0.0135 0.0137 0.0139 0.186 0.236 0.286 0.0073 0.0093 0.0113 0.130 0.180 0.230 0.0051 0.0071 0.0090 0.545 0.615 0.685 0.0215 0.0242 0.0270 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1457-08CP Chip Scale Package
# per tape and reel
Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CM1457-08CP CHIP SIZE (mm) 3.27 X 1.05 X 0.615 POCKET SIZE (mm) B0 X A0 X K0 3.40 X 1.27 X 0.73 TAPE WIDTH W 12mm REEL DIAMETER 330mm (13") QTY PER REEL 3500 P0 4mm P1 4mm
Rev. 4 | Page 8 of 9 | www.onsemi.com
CM1457
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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Rev. 4 | Page 9 of 9 | www.onsemi.com

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